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从双层到多层带有微结构的硅硅直接键合技术研究

袁星 陶智 李海旺 谭啸 孙加冕

袁星, 陶智, 李海旺, 谭啸, 孙加冕. 从双层到多层带有微结构的硅硅直接键合技术研究[J]. 航空动力学报, 2016, 31(11): 2628-2634. doi: 10.13224/j.cnki.jasp.2016.11.009
引用本文: 袁星, 陶智, 李海旺, 谭啸, 孙加冕. 从双层到多层带有微结构的硅硅直接键合技术研究[J]. 航空动力学报, 2016, 31(11): 2628-2634. doi: 10.13224/j.cnki.jasp.2016.11.009
YUAN Xing, TAO Zhi, LI Hai-wang, TAN Xiao, SUN Jia-mian. Investigation of bonding with micro structures starting fromdouble layers to multi-layers[J]. Journal of Aerospace Power, 2016, 31(11): 2628-2634. doi: 10.13224/j.cnki.jasp.2016.11.009
Citation: YUAN Xing, TAO Zhi, LI Hai-wang, TAN Xiao, SUN Jia-mian. Investigation of bonding with micro structures starting fromdouble layers to multi-layers[J]. Journal of Aerospace Power, 2016, 31(11): 2628-2634. doi: 10.13224/j.cnki.jasp.2016.11.009

从双层到多层带有微结构的硅硅直接键合技术研究

doi: 10.13224/j.cnki.jasp.2016.11.009
基金项目: 

国家自然科学基金(51506002)

详细信息
    作者简介:

    袁星(1981-),男,湖南郴州人,讲师,博士生,主要从事微尺度通道流动换热研究。

  • 中图分类号: V21;TN305

Investigation of bonding with micro structures starting fromdouble layers to multi-layers

  • 摘要: 通过理论分析和实验验证对多层带有微结构的硅硅直接键合技术进行了研究.采用的硅片表面活化处理方法是亲水湿法,采用的键合工艺流程是先将硅片在键合机中进行预键合,再使用退火炉进行高温退火.其中预键合参数对多层键合成功与否起到决定性的作用,为节约实验时间,针对3个主要预键合参数(温度、压力、时间)的选取进行了详细的正交实验分析.使用项目组自制的硅硅键合分析软件对键合片的红外图像进行处理分析,计算键合率.采用实验得到的最佳预键合工艺参数,多层键合的键合率达到了86.6527%.

     

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出版历程
  • 收稿日期:  2016-08-23
  • 刊出日期:  2016-11-28

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