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基于多孔介质的指尖密封各向异性传热模型

王强 胡娅萍 吉洪湖

王强, 胡娅萍, 吉洪湖. 基于多孔介质的指尖密封各向异性传热模型[J]. 航空动力学报, 2017, 32(11): 2585-2595. doi: 10.13224/j.cnki.jasp.2017.11.004
引用本文: 王强, 胡娅萍, 吉洪湖. 基于多孔介质的指尖密封各向异性传热模型[J]. 航空动力学报, 2017, 32(11): 2585-2595. doi: 10.13224/j.cnki.jasp.2017.11.004
Anisotropic heat transfer model of finger seal based on porous media[J]. Journal of Aerospace Power, 2017, 32(11): 2585-2595. doi: 10.13224/j.cnki.jasp.2017.11.004
Citation: Anisotropic heat transfer model of finger seal based on porous media[J]. Journal of Aerospace Power, 2017, 32(11): 2585-2595. doi: 10.13224/j.cnki.jasp.2017.11.004

基于多孔介质的指尖密封各向异性传热模型

doi: 10.13224/j.cnki.jasp.2017.11.004
基金项目: 国家自然科学基金(51106072); 航空科学基金(2014ZB52027);江苏省普通高校研究生科研创新计划项目(KYLX16_0398);中央高校基本科研业务费专项资金

Anisotropic heat transfer model of finger seal based on porous media

  • 摘要: 在指尖密封多孔介质流动模型的基础上,将指尖密封片之间的接触传热附加于固体导热之中,之后通过对密封固体结构与结构内流体的耦合各向异性传热进行理论分析,建立了指尖密封各向异性传热数学模型;基于商业软件Fluent中的用户自定义标量(UDS)方程功能,开发了多孔介质各向异性传热数值计算模块,并数值模拟了指尖密封结构内的流动与传热特性。结果表明:指梁与指尖靴区域的各向异性有效导热系数张量与孔隙率、径向和周向位置以及轴向接触热阻等因素相关;指尖密封最高温度出现在指尖靴与转子接触面的略下游处;与各向同性传热模型相比,采用各向异性传热模型时,指梁下部和指尖靴区域沿径向和轴向存在较大温度梯度,但温度沿周向的变化两者均很小;泄漏量随着压差的增加逐渐增大,随着转子转速的增加基本不变;指尖密封最高温度值随着压差的增加逐渐减小,随着转子转速的增加逐渐增大。

     

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出版历程
  • 收稿日期:  2016-04-21
  • 刊出日期:  2017-11-28

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