Thermo-elastic coupling analysis of round-hole flat-plate film-cooling

The thermo-elastic coupling property of the basic cooling configuration of flat-plate with round-hole was analyzed. The factors that may influence the steady state thermal stress were studied. The thermal stress distribution of the round-hole flat-plate film-cooling was predicted and analyzed using the multi-field coupling method. The influences of the injection angle, compound angle and blowing ratio on thermal stress were systematically investigated. The results show that the overall thermal stress in the flat-plate is much lower than that of the place around the film holes, and the thermal stress only concentrates near the leading edge line and trailing edge line of the film holes, while the thermal stress remains low on the lateral sides of the film holes. The inner force imposed on the film holes is perpendicular to the axis of film hole. The higher blowing ratio means higher temperature gradient near the film holes, and more intensive thermal stress concentration near the leading edge line and tailing edge line. The smaller injection angle means higher thermal stress near the film holes, and more serious thermal stress concentration on the leading edge point of the film hole exit and the trailing edge point of the film hole inlet. The compound angle is beneficial to weakening the thermal stress concentration.