Volume 31 Issue 6
Jun.  2016
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MA Dan-dan, XIA Guo-dong, ZHAI Yu-ling, LI Yun-fei, JIANG Jing. Flow and heat transfer characteristics for inter-layer liquid cooling of 3D-IC with staggered micro-pin fins[J]. Journal of Aerospace Power, 2016, 31(6): 1327-1334. doi: 10.13224/j.cnki.jasp.2016.06.007
Citation: MA Dan-dan, XIA Guo-dong, ZHAI Yu-ling, LI Yun-fei, JIANG Jing. Flow and heat transfer characteristics for inter-layer liquid cooling of 3D-IC with staggered micro-pin fins[J]. Journal of Aerospace Power, 2016, 31(6): 1327-1334. doi: 10.13224/j.cnki.jasp.2016.06.007

Flow and heat transfer characteristics for inter-layer liquid cooling of 3D-IC with staggered micro-pin fins

doi: 10.13224/j.cnki.jasp.2016.06.007
  • Received Date: 2014-09-25
  • Publish Date: 2016-06-28
  • The laminar flow and heat transfer characteristics of fluid were numerically investigated through uniform and double-side heat flux 3D-IC ( three-dimensional integration circuit) with interlayer heat-removal structure for heat transfer areas of 1cm2 and volume flow ringing from 36mL/min to 290mL/min. 3D-IC with rectangle micro-channels and staggered micro-pin fins for pitches of 200μm and structure heights of 200μm was analyzed. Results show that inter-layer liquid cooling of 3D-IC with staggered micro-pin fins has better heat exchange effect than that with rectangle micro-channels. For the heat flux density of 1.25MW/m2,the average temperature and maximum temperature of the heating surface are only 318.31,323.16K, decreased 12.31,20.14K than that with rectangle micro-channels at the volume flow of 290mL/min, corresponding to about total power of 250W and volume heat source of 8.3kW/cm3.

     

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