Volume 32 Issue 7
Jul.  2017
Turn off MathJax
Article Contents
Flow and heat transfer characteristics of interlayer liquid cooling for 3D-IC with two stacked layers[J]. Journal of Aerospace Power, 2017, 32(7): 1569-1576. doi: 10.13224/j.cnki.jasp.2017.07.005
Citation: Flow and heat transfer characteristics of interlayer liquid cooling for 3D-IC with two stacked layers[J]. Journal of Aerospace Power, 2017, 32(7): 1569-1576. doi: 10.13224/j.cnki.jasp.2017.07.005

Flow and heat transfer characteristics of interlayer liquid cooling for 3D-IC with two stacked layers

doi: 10.13224/j.cnki.jasp.2017.07.005
  • Received Date: 2015-11-05
  • Publish Date: 2017-07-28
  • With the vertical stacking of circuit layers, the power density of 3D-IC increases exponentially. Interlayer liquid cooling is a promising and scalable solution for high heat flux removal in 3D-IC (three-dimensional integration circuit). The flow and heat transfer performances of water through uniform and double-side heat flux 3D-IC of interlayer in-line micro-pin fins structure with heat transfer areas of 1cm2 and Reynolds number ranging from 150 to 900 were studied numerically. 3D-IC with in-line micro-pin fins for pitches of 200μm, diameter of 100μm and heights of 200μm was analyzed. Results show that interlayer liquid cooling of 3D-IC with in-line micro-pin fins has better heat exchange effect than that with rectangular micro-channels. For the Reynolds number of 770, the power reaches to 250W, which is equivalent to 8.3kW/cm3 volumetric heat. Compared with rectangular micro-channels,the average temperature and the maximal junction temperature of the heater surface with in-line micro-pin fins are only 46.34, 13.96K, down by 13.26, 21.34K, respectively.

     

  • loading
  • [1]
    BRUNSCHWILER T,MICHEL B.Handbook of 3D integration:technology and applications of 3D integrated circuits[M].Hoboken,NJ:John Wiley and Sons Incorporation,2008.
    [2]
    IM S,BANERJEE K.Full chip thermal analysis of planar (2-D) and vertically integrated (3-D) high performance ICs[R].San Francisco,CA:Electron Devices Meeting,2000.
    [3]
    CONG J,LUO G,SHI Y.Thermal-aware cell and through-silicon-via co-placement for 3D ICs[R].San Diego,CA:Proceedings of the 48th Design Automation Conference,2011.
    [4]
    TSAI M C,WANG T C,HWANG T T.Through-silicon via planning in 3-D floor planning[J].Very Large Scale Integration Systems,2011,19(8):1448-1457.
    [5]
    CONG J,WEI J,ZHANG Y.A thermal-driven floorplanning algorithm for 3D ICs[R].San Jose,CA:IEEE/Association for Computing Machinery(ACM) International Conference,2004.
    [6]
    CONG J,ZHANG Y.Thermal-driven multilevel routing for 3-D ICs[R].Shanghai:The Asia and South Pacific Design Automation Conference,2005.
    [7]
    MELAMED S,THOROLFSSON T,SRINIVASAN A,et al.Junction-level thermal extraction and simulation of 3D ICs[R].San Francisco,CA:IEEE International Conference,2009.
    [8]
    TUCKERMAN D B,PEASE R F W.High-performance heat sinking for VLSI[J].Electron Device Letters,1981,2(5):126-129.
    [9]
    HASAN M I,RAGEB A A,YAGHOUBI A,et al.Influence of channel geometry on the performance of a counter flow microchannel heat exchanger[J].International Journal of Thermal Sciences,2009,48(8):1607-1618.
    [10]
    ROSA P,KARAYIANNIS T G,COLLINS M W.Single-phase heat transfer in microchannels:the importance of scaling effects[J].Applied Thermal Engineering,2009,29(17):3447-3468.
    [11]
    GUO Z Y,LI Z X.Size effect on single-phase channel flow and heat transfer at microscale[J].International Journal of Heat and Fluid Flow,2003,24(3):284-298.
    [12]
    XIA G D,CHAI L,WANG H,et al.Optimum thermal design of microchannel heat sink with triangular reentrant cavities[J].Applied Thermal Engineering,2011,31(6/7):1208-1219.
    [13]
    BRUNSCHWILER T,MICHEL B,ROTHUIZEN H,et al.Forced convective interlayer cooling in vertically integrated packages[R].Orlando,FL:The 11th Intersociety Conference,2008.
    [14]
    LINDERMAN R J,BRUNSCHWILER T,KLOTER U,et al.Hierarchical nested surface channels for reduced particle stacking and low-resistance thermal interfaces[R].San Jose,CA:Semiconductor Thermal Measurement and Management Symposium,2007.
    [15]
    VOGEL M R.Liquid cooling performance for a 3-D multichip module and miniature heat sink[J].IEEE Transactions on Components,Packaging,and Manufacturing Technology:Part A,1995,18(1):68-73.
    [16]
    CHEN X Y,TOH K C,CHAI J C,et al.Direct liquid cooling of a stacked multichip module[R].Singapore City:Electronics Packaging Technology Conference,2002.
    [17]
    BRUNSCHWILER T,MICHEL B,ROTHUIZEN H,et al.Interlayer cooling potential in vertically integrated packages[J].Microsystem Technologies,2009,15(1):57-74.
    [18]
    KADDI P,REDDY B K,SINGH S G,et al.Active cooling technique for efficient heat mitigation in 3D-ICs[R].Mumbai,India:The 13th International Conference on Embedded Systems,2014.
    [19]
    ANDRY P S,TSANG C,SPROGIS E,et al.A CMOS-compatible process for fabricating electrical through-vias in silicon[R].San Diego,CA:The 56th Electronic Components and Technology Conference,2006.
    [20]
    JAIN A,JONES R E,CHATTERJEE R,et al.Thermal modeling and design of 3D integrated circus[R].Orlando,FL:The 11th Intersociety Conference,2008.
    [21]
    QU W,MUDAWAR I.Experimental and numerical study of pressure drop and eat transfer in a single-phase micro-channel heat sink[J].International Journal of Heat and Mass Transfer,2002,45(12):2549-2565.
    [22]
    SHAH R K.Laminar flow friction and forced convection heat transfer in ducts of arbitrary geometry[J].International Journal of Heat and Mass Transfer,1975,18(7):849-862.
    [23]
    STEINKE M E,KANDIKAR S G.Single-phase liquid friction factors inmicrochannels[R].International Journal of Thermal Science,2006,45(11):1073-1083.
    [24]
    XIA G D,ZHAI Y,CUI Z.Numerical investigation of thermal enhancement in a micro heat sink with fan-shaped reentrant cavities and internal ribs[J].Applied Thermal Engineering,2013,58(1/2):495-498.
  • 加载中

Catalog

    通讯作者: 陈斌, bchen63@163.com
    • 1. 

      沈阳化工大学材料科学与工程学院 沈阳 110142

    1. 本站搜索
    2. 百度学术搜索
    3. 万方数据库搜索
    4. CNKI搜索

    Article Metrics

    Article views (1024) PDF downloads(531) Cited by()
    Proportional views
    Related

    /

    DownLoad:  Full-Size Img  PowerPoint
    Return
    Return