Volume 32 Issue 11
Nov.  2017
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Anisotropic heat transfer model of finger seal based on porous media[J]. Journal of Aerospace Power, 2017, 32(11): 2585-2595. doi: 10.13224/j.cnki.jasp.2017.11.004
Citation: Anisotropic heat transfer model of finger seal based on porous media[J]. Journal of Aerospace Power, 2017, 32(11): 2585-2595. doi: 10.13224/j.cnki.jasp.2017.11.004

Anisotropic heat transfer model of finger seal based on porous media

doi: 10.13224/j.cnki.jasp.2017.11.004
  • Received Date: 2016-04-21
  • Publish Date: 2017-11-28
  • An anisotropic heat transfer model was built by theoretically analyzing the contact and anisotropic heat transfer characteristics coupled finger seal and fluid flow within the structure on the basis of porous model. Then, an anisotropic heat transfer numerical calculation model was developed on the basis of userdefined scalar (UDS) function of commercial software Fluent, and the heat transfer and flow characteristics of finger seal were simulated. Results showed that the effective thermal conductivity tenser of finger beam and finger foot was related to the factors of porosity, radial and circumferential position, and axial contact resistance. The highest temperature of finger seal appeared slightly downstream the contact surface between finger foot and rotor. Besides, compared with isotropic heat transfer model, the temperature decreased greatly at radial and axial directions in finger foot and lower part of finger beam zones while using anisotropic heat transfer model, however, it remained unchanged in circumference both of them. Seal leakage increased with the increasing pressure differential but kept stable with the increasing rotation speed. The height temperature decreased with the increasing pressure differential but increased with the increasing rotation speed.

     

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  • [1]
    ARORA G K,PROCTOR M P,STEINETZ B M,et al.Pressure balanced,low hysteresis,seal test results[R].Cleveland,USA:NASA Glenn Research Center,1999.
    [2]
    PROCTOR M P,KUMAR A,DELGADO I R.Highspeed,hightemperature finger seal test results[J].Journal of Propulsion and Power,2004,20(2):312-318.
    [3]
    PROCTOR M P,DELGADO I R.Preliminary test results of a noncontacting finger seal on a herringbonegrooved rotor[R].AIAA-2008-4506,2008.
    [4]
    申晓龙,陈国定,苏华.结构及工况对人字型指尖气浮密封的性能影响[J].航空动力学报,2011,26(2):416-421.SHEN Xiaolong,CHEN Guoding,SU Hua.Sealing performances analysis for a herringbonegrooved finger gas seal structure and working parameter[J].Journal of Aerospace Power,2011,26(2):416-421.(in Chinese)
    [5]
    郎达学,苏华.表面织构靴底流体动压指尖密封的性能分析[J].航空学报,2012,33(8):1540-1546.LANG Daxue,SU Hua.Performance analysis of surface texture padded finger seal[J].Acta Aeronautica et Astronautica Sinica,2012,33(8):1540-1546.(in Chinese)
    [6]
    ZHANG H,ZHENG Q,YUE G,et al.Unsteady numerical analysis of a whole ring of finger seal with grooves on finger pads[R].ASME Paper GT2013-94514,2013.
    [7]
    FLEMING D P.Approximate solution for choked flow in gas seal pads[R].Cleveland,USA:NASA Glenn Research Center,2004.
    [8]
    CIOC S,FLEMING D P,KEITH T G,et al.Numerical investigation of choked flow in padded finger seals[R].World Tribology Congress,WTC-2005-64006,2005.
    [9]
    BRAUN M J,KUDRIAVTSEV V V,STEINETZ B M,et al.Two and threedimensional numerical experiments representing two limiting cases of an inline pair of finger seal components[J].International Journal of Rotating Machinery,2003,9(3):171-179.
    [10]
    BRAUN M J,LI H.An integrated numerical fluidsolid interaction model for finger seals with a padded lowpressure laminate[R].San Diego,California USA:ASME/STLE International Joint Tribology Conference,2007.
    [11]
    李国见,李建华,陈国定,等.动压型指尖密封泄漏特性的分析[J].科学技术与工程,2007,7(13):3157-3159.LI Guojian,LI Jianhua,CHEN Guoding,et al.Analysis to the leakage patterns of hydrodynamic pressure finger seals[J].Science Technology and Engineering,2007,7(13):3157-3159.(in Chinese)
    [12]
    YUE G,ZHENG Q,ZHU R.Numerical simulation of a padded finger seal[R].ASME Paper GT2008-50997,2008.
    [13]
    ZHANG H,ZHENG Q,YUE G.Study on the leakage and deformation characteristics of the finger seals by using numerical simulation[R].ASME Paper GT20101-23194,2010.
    [14]
    王旭,张文平,来亮,等.指尖密封泄漏流动的数值仿真分析[J].航空动力学报,2005,20(4):590-594.WANG Xu,ZHANG Wenping,LAI Liang,et al.Numerical simulation and analysis of a finger seal leakage flow[J].Journal of Aerospace Power,2005,20(4):590-594.(in Chinese)
    [15]
    BRAUN M J,PIERSON H M,DENG D.Thermofluids considerations and the dynamic behavior a finger seal assembly[J].Tribology Transactions,2005,48(4):531-547.
    [16]
    苏华,陈国定.指尖密封的温度场及热结构耦合分析[J].航空动力学报,2009,24(1):196-203.SU Hua,CHEN Guoding.Analysis of temperature field and coupled thermal and structure for finger seal[J].Journal of Aerospace Power,2009,24(1):196-203.(in Chinese)
    [17]
    BRAUN M J,HENDRICKS R C,CANACCI V A.Nonintrusive qualitative and quantitative flow characterization and bulk flow model for brush seals[R].Nagoya,Japan:International Tribology Conference,1990.
    [18]
    HENDRICKS R C,SCHLUMBERGER J,BRAUN M J.A bulk flow model of a brush seal system[R].Orlando,USA:International Gas Turbine and Aeroengine Congress and Exposition,1991.
    [19]
    白花蕾.指式封严泄漏特性的实验研究和数值模拟[D].南京:南京航空航天大学,2008.BAI Hualei.Experimental and numerical study on leakage characteristics of finger seal[D].Nanjing:Nanjing University of Aeronautics and Astronautics,2008.(in Chinese)
    [20]
    曹静,吉洪湖,金峰,等.指式封严结构中气流流动与传热特性分析[J].航空发动机,2011,37(4):33-36.CAO Jing,JI Honghu,JIN Feng,et al.Analysis of air flow and heat transfer characteristics in finger seal structure[J].Aeroengine,2011,37(4):33-36.(in Chinese)
    [21]
    林瑞泰.多孔介质传热传质引论[M].北京:科学出版社,1995.
    [22]
    张洪济.热传导[M].北京:高等教育出版社,1992.
    [23]
    COOPER M G,MIKIC B B,YOVANOVICH M M.Thermal contact conductance[J].International Journal of Heat and Mass Transfer,1969,12(3):279-300.
    [24]
    MILANEZ F H,YOVANOVICH M M,CULHAM J R.Effect of surface asperity truncation on thermal contact conductance[J].IEEE Transactions on Components and Packaging Technologies,2003,26(1):48-54.
    [25]
    王峰,陈国定,余承涛.基于粗糙接触的指尖密封热分析[J].机械科学与技术,2007,26(7):893-896.WANGFeng,CHEN Guoding,YU Chengtao.Thermal analysis of the finger seal system with rough contact[J].Mechanical Science and Technology for Aerospace Engineering,2007,26(7):893-896.(in Chinese)
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