Volume 39 Issue 3
Mar.  2024
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ZHOU Hua, TANG Wei, ZENG Yun, et al. A self-similarity heat sink with the structure of deflector hole[J]. Journal of Aerospace Power, 2024, 39(3):20210475 doi: 10.13224/j.cnki.jasp.20210475
Citation: ZHOU Hua, TANG Wei, ZENG Yun, et al. A self-similarity heat sink with the structure of deflector hole[J]. Journal of Aerospace Power, 2024, 39(3):20210475 doi: 10.13224/j.cnki.jasp.20210475

A self-similarity heat sink with the structure of deflector hole

doi: 10.13224/j.cnki.jasp.20210475
  • Received Date: 2021-08-30
    Available Online: 2023-11-03
  • Self-similarity heat sink (SSHS) has the advantages of compact structure design, prominent heat transfer performance and extendibility, which can be applied in cooling the electronic chips. A new SSHS with the structure of deflector hole was proposed to overcome the maldistribution and improve the overall heat transfer performance. Numerical simulation was carried out to validate the new structure design of the SSHS. For the SSHS with the structure of deflector hole, the coolant was distributed to the deflector holes, subsequently impinged the bottom of the overflow channels, which enhanced the heat transfer of the SSHS. Comparison between the original and optimized SSHS was carried out with respect to flow distribution uniformity, heat transfer capacity and heat dissipation uniformity. For the mass flow rate covering 0.58−1.44 kg/h, the optimized SSHS had a better flow distribution uniformity, the maximum temperature on the heating surface was reduced by 10 K, the heat dissipation uniformity was increased by 57%, and average pressure drop was reduced by 10.4% compared with the original SSHS. The geometric dimensions of the deflector holes were further optimized, and better flow distribution and overall heat dissipation performance were achieved with the sacrifice of increasing the pressure drop of 16.5% compared with the optimized SSHS.

     

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