Volume 24 Issue 1
Jan.  2009
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SU Hua, CHEN Guo-ding. Analysis of temperature field and coupled thermal and structure for finger seal[J]. Journal of Aerospace Power, 2009, 24(1): 196-203.
Citation: SU Hua, CHEN Guo-ding. Analysis of temperature field and coupled thermal and structure for finger seal[J]. Journal of Aerospace Power, 2009, 24(1): 196-203.

Analysis of temperature field and coupled thermal and structure for finger seal

  • Received Date: 2007-12-25
  • Rev Recd Date: 2008-03-05
  • Publish Date: 2009-01-28
  • The thermal analysis model for a repetitive section of single stick,two-layer finger seal was established herein.The thermal analysis boundary conditions were confirmed according to the finger seal's working situations.The temperature field in different conditions of the finger seal sections,including the rotor and the back plate,was obtained using the finite element method(FEM).It shows that the position of the highest temperature part of the finger seal is related to the upstream temperature.The highest temperature part moves from the finger foot to the middle part of the high pressure finger stick with the increase of upstream temperature.The coupled thermal and structural analysis of finger seal was also conducted and the finger seal's hysteresis and contacting performances considering the thermal character effect were obtained.If compared with the performance analysis results without considering the thermal effect,the hysteresis is lower and the contact pressure between the finger foot and the rotor is much higher with consideration of the thermal effect.

     

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      沈阳化工大学材料科学与工程学院 沈阳 110142

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