Volume 27 Issue 12
Dec.  2012
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WU Hong, YANG Qing. Large eddy simulation of anti-vortex film cooling[J]. Journal of Aerospace Power, 2012, 27(12): 2648-2654.
Citation: WU Hong, YANG Qing. Large eddy simulation of anti-vortex film cooling[J]. Journal of Aerospace Power, 2012, 27(12): 2648-2654.

Large eddy simulation of anti-vortex film cooling

  • Received Date: 2012-06-19
  • Publish Date: 2012-12-28
  • Large eddy simulation was used to investigate the fluid flow and heat transfer mechanism of anti-vortex film cooling. The interaction between the main hole and the side holes was obtained, and the mechanism that turbulence structures affected film cooling effectiveness was analyzed by comparing with standard round hole case for the same blowing rate. It is found that the presence of side hole jets decrease the size and strength of the counter-rotating vortex pair of the main hole jet, and supply coolant for its entrainment. The temperature of the main hole jet does not rise sharply at the exit of the main hole because the side hole jets supply to the low-pressure area behind the exit of the main hole. Due to the side hole jets' effect, the main hole jet does not form whole hairpin structures but near-wall streaks, decreasing its mixing with the main hot stream and enabling the coolant to cover and cool down the wall better.

     

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