留言板

尊敬的读者、作者、审稿人, 关于本刊的投稿、审稿、编辑和出版的任何问题, 您可以本页添加留言。我们将尽快给您答复。谢谢您的支持!

姓名
邮箱
手机号码
标题
留言内容
验证码

并联硅基扩缩微通道热沉强化传热特性

柴磊 夏国栋 周明正 崔珍珍

柴磊, 夏国栋, 周明正, 崔珍珍. 并联硅基扩缩微通道热沉强化传热特性[J]. 航空动力学报, 2013, 28(12): 2725-2730.
引用本文: 柴磊, 夏国栋, 周明正, 崔珍珍. 并联硅基扩缩微通道热沉强化传热特性[J]. 航空动力学报, 2013, 28(12): 2725-2730.
CHAI Lei, XIA Guo-dong, ZHOU Ming-zheng, CUI Zhen-zhen. Heat transfer enhancement characteristics of parallel-microchannel silicon heat sink with expansion-constriction cross sections[J]. Journal of Aerospace Power, 2013, 28(12): 2725-2730.
Citation: CHAI Lei, XIA Guo-dong, ZHOU Ming-zheng, CUI Zhen-zhen. Heat transfer enhancement characteristics of parallel-microchannel silicon heat sink with expansion-constriction cross sections[J]. Journal of Aerospace Power, 2013, 28(12): 2725-2730.

并联硅基扩缩微通道热沉强化传热特性

基金项目: 国家自然科学基金(51176002);国家重点基础研究发展计划(2011CB710704);教育部博士点学科专项科研基金(20111103110009)

Heat transfer enhancement characteristics of parallel-microchannel silicon heat sink with expansion-constriction cross sections

  • 摘要: 采用去离子水作为冷却工质,实验研究了并联硅基扩缩微通道热沉内的流体流动与强化传热特性.基于微尺度强化传热机理,设计加工了两种并联硅基扩缩微通道热沉.通过测量流体的体积流量、进出口压降与温度、热沉底面加热膜温度,并以传统矩形直通道热沉为参照,获得了并联硅基扩缩微通道热沉在恒热流边界条件和不同体积流量工况下流体流动与对流传热特性参数.结果显示:相对于矩形直通道,并联硅基扩缩微通道热沉的表面传热系数可提高12.5%~85.1%,但摩擦因数只增加了-9.2%~31.4%.表明并联硅基扩缩微通道热沉具有优越的强化传热特性.

     

  • [1] 王艳.基于MEMS加工工艺的复杂结构微通道散热器研究[D].上海:上海交通大学, 2009. WANG Yan.Investigation of microchannel heat sink with complicated channel structure based on MEMS technologies[D].Shanghai:Shanghai Jiaotong University, 2009.(in Chinese)
    [2] Xu J L, Gan Y H.Microscale heat transfer enhancement using thermal boundary layer redeveloping concept[J].International Journal of Heat and Mass Transfer, 2005, 48(9):1662-1674.
    [3] Xu J L, Song Y X.Numerical simulations of interrupted and conventional microchannel heat sinks[J].International Journal of Heat and Mass Transfer, 2008, 51(25):5906-5917.
    [4] Chen Y P, Cheng P.Heat transfer and pressure drop in fractal tree-like microchannel nets[J].International Journal of Heat and Mass Transfer, 2002, 45(13):2643-2648.
    [5] Chen Y P, Cheng P.An experimental investigation on the thermal efficiency of fractal tree-like microchannel nets[J].International Communications in Heat and Mass Transfer, 2005, 32(7):931-938.
    [6] Guzmán A M, Cardenas M J.Heat transfer enhancement by flow bifurcations in asymmetric wavy wall channels[J].International Journal of Heat and Mass Transfer, 2009, 52(15):3778-3789.
    [7] Sui Y, Teo C J.Fluid flow and heat transfer in wavy microchannels[J].International Journal of Heat and Mass Transfer, 2010, 53(13):2760-2772.
    [8] Sui Y, Lee P S.An experimental study of flow friction and heat transfer in wavy microchannels with rectangular cross section[J].International Journal of Thermal Sciences, 2011, 50(12):2473-2482.
    [9] Mohammed H A, Gunnasegaran P.Numerical simulation of heat transfer enhancement in wavy microchannel heat sink[J].International Communications in Heat and Mass Transfer, 2011, 38(1):63-68.
    [10] Promvonge P, Sripattanapipat S.Numerical investigation of laminar heat transfer in a square channel with 45° inclined baffles[J].International Communications in Heat and Mass Transfer, 2010, 37(2):170-177.
    [11] Promvonge P, Sripattanapipat S.Laminar periodic flow and heat transfer in square channel with 45° inline baffles on two opposite walls[J].International Journal of Thermal Sciences, 2010, 49(6):963-975.
    [12] Promvonge P, Jedsadaratanachai W.Numerical study of laminar flow and heat transfer in square channel with 30° inline angled baffle turbulators[J].Applied Thermal Engineering, 2010, 30(11):1292-1303.
    [13] Xia G D, Chai L, Zhou M Z.Effects of structural parameters on fluid flow and heat transfer in a microchannel with aligned fan-shaped reentrant cavities[J].International Journal of Thermal Sciences, 2011, 50(3):411-419.
    [14] Xia G D, Chai L, Wang H Y.Optimum thermal design of microchannel heat sink with triangular reentrant cavities[J].Applied Thermal Engineering, 2011, 31(6):1208-1219.
    [15] 景思睿, 张鸣远.流体力学[M].西安:西安交通大学出版社, 2001.
    [16] Loosen P.Cooling and packaging of high-power diode lasers[J].High-Power Diode Lasers, 2000, 78:289-301.
  • 加载中
计量
  • 文章访问数:  1291
  • HTML浏览量:  3
  • PDF量:  900
  • 被引次数: 0
出版历程
  • 收稿日期:  2012-11-05
  • 刊出日期:  2013-12-28

目录

    /

    返回文章
    返回