Investigation on adhesive interface specimen deformation and failure process under tension using digital speckle correlation method
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摘要: 对黏接界面试件拉伸变形破坏过程进行了观察,通过编制数字散斑相关方法(DSCM)处理图像,提取得到试件表面随着载荷变化而变化的位移场和应变场及其演化过程.结果表明:带预制脱黏黏接界面试件在拉伸过程中,由于预制脱黏尖端附近产生应变集中将产生起裂.DSCM能较好地应用于黏接界面试件表面的变形和破坏分析中,定量测量了界面变形场,并与试验结果相吻合.Abstract: The deformation and failure process of adhesive interface specimen under tension was observed. By digital speckle correlation method (DSCM) to deal with images, displacement and strain field of speciman surface varying with load and their evolution process were achieved. The results show that during the tensile process the adhesive interface specimen with stress-release flap could be vulnerable crack at the tip of stress-release flap because of strain concentration. DSCM is an effective experimental method for studying characteristic of deformation and failure of adhesive interface specimen. The quantificational measurement results of adhesive interface deformation field are consistent with the data obtained from the experiment.
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