Z-pin高效拉挤用双马来酰亚胺树脂改性

周洲; 还大军; 李勇; 李丽沙; 刘洪全; 焦洋

doi:10.13224/j.cnki.jasp.20200479

Z-pin高效拉挤用双马来酰亚胺树脂改性

doi: 10.13224/j.cnki.jasp.20200479

南京航空航天大学材料科学与技术学院，南京 210016

基金项目: 装备预研共用技术项目（41422020110）

详细信息

作者简介:
周洲（1997-），男，助理工程师，硕士，主要从事高性能复合材料成型工艺的研究。

中图分类号: V258;TB332
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- 文章访问数: 330
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- 被引次数: 0
出版历程
- 收稿日期: 2020-11-09
- 刊出日期: 2021-10-28

Bismaleimide resin modification for Z-pin high efficiency pultrusion

College of Materials Science and Technology，Nanjing University of Aeronautics and Astronautics，Nanjing 210016，China

摘要

摘要: 为了满足双马来酰亚胺树脂（BMI）应用于Z-pin高效拉挤的需求，要求其具有低黏度（500 $m P a ? s$ ）、耐热（玻璃化转变温度大于200 ℃）、固化快以及韧性好等性能。使用TDE-85环氧树脂（EP）降低BMI黏度，并进一步加入改性剂提高树脂的耐热性和力学性能。分别采用黏度测试、差示扫描量热分析、热重分析、力学性能测试等方法研究树脂固化工艺、固化反应动力学、耐热性以及基本力学性能，筛选最佳树脂体系制备Z-pin并进行性能测试与分析。研究结果表明：TDE-85环氧树脂的加入可以有效降低树脂体系的黏度，满足高效拉挤工艺性需求。加入改性剂二苯甲烷二异氰酸酯（MDI）提高了EP-BMI体系的韧性和耐热性，玻璃化转变温度为251 ℃，综合性能达到最优。浇铸体拉伸强度、冲击强度分别为66 MPa、21 kJ/m²，分别提高了38%、53%。Z-pin短梁剪强度为67 MPa，与基体结合强度为31.2 MPa。改性树脂体系充分满足Z-pin高效拉挤的工艺需求和性能要求，具有良好的工程应用价值。
- 复合材料 /
- Z-pin增强 /
- 树脂改性 /
- 高效拉挤 /
- 双马来酰亚胺
Abstract: To meet the demand of bismaleimide resin （BMI） for Z-pin high efficient pultrusion applications，its properties such as low viscosity （500 mPa·s），heat resistance （glass transition temperature is more than 200 ℃），fast curing and good toughness shall be required.TDE-85 epoxy resin （EP） was used to reduce the viscosity of BMI，and further modifiers were added to improve the heat resistance and mechanical properties of the resin.Viscosity test，differential scanning calorimetry，thermogravimetric analysis and mechanical properties test were used to study the curing process，curing reaction kinetics，heat resistance and basic mechanical properties of the resin，and the best resin system was selected for the preparation of Z-pin and performance test and analysis.The results showed that the addition of TDE-85 epoxy resin can effectively reduce the viscosity of the resin system and meet the demand of high efficiency pultrusion process.The addition of modifier diphenylmethane （MDI） improved the toughness and heat resistance of EP-BMI system.The glass transition temperature was 251 ℃，and the comprehensive performance was optimized.The tensile strength and impact strength of the cast body were 66 MPa and 21 kJ/m²，which increased by 38% and 53%，respectively.The short beam shear strength of Z-pin was 67 MPa and the bond strength with the substrate was 31.2 MPa.In summary，the modified resin system can fully meet the process requirements and performance requirements of high efficiency pultrusion of Z-pin.It has good engineering application value.
- composite materials /
- Z-pin reinforcement /
- resin modification /
- high efficiency pultrusion /
- bismaleimide

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参考文献(25)

[1]	张向阳,李勇,褚奇奕,等.碳纤维/酚醛树脂体系Z-pin加捻拉挤工艺及其性能[J].航空动力学报,2015,30（7）:1638-1644.
[2]	包建文,蒋诗才,张代军.航空碳纤维树脂基复合材料的发展现状和趋势[J].科技导报,2018,36（19）:52-63.
[3]	GAYE K,ERDEM S.Impact resistance of Z-pin-reinforced sandwich composites[J].Journal of Composite Materials,2019,53（26/27）:3681-3699.
[4]	冯波,王晓洁,惠雪梅.复合材料Z-pin增强技术研究现状[J].玻璃钢/复合材料,2012（2）:82-85.
[5]	LIU S Y,CHEN Y Z,CHEN P，et al.Properties of novel bismaleimide resins and thermal ageing effects on the ILSS performance of their carbon fibre bismaleimide composites[J].Polymer Composites,2019,40（Suppl.2）:1283-1293.
[6]	宣海军,陆晓,洪伟荣,等.航空发动机机匣包容性研究综述[J].航空动力学报,2010,25（8）:1860-1870.
[7]	宋健,温卫东.不同温度下树脂基复合材料层合板力学性能试验[J].航空动力学报,2016,31（4）:1006-1018.
[8]	张勇波,傅惠民,王治华.CCF300/QY8911单向纤维增强复合材料纵向压缩性能预测[J].航空动力学报,2013,28（6）:1231-1235.
[9]	李健芳,郭鸿俊,高杨,等.MT300/802双马树脂基复合材料固化工艺及高温力学性能[J].宇航材料工艺,2019,49（4）:34-40.
[10]	赵渠森.QY8911树脂系列及其工程应用[J].工程塑料应用,1995（1）:1-8.
[11]	GU A J.High performance bismaleimide/cyanate ester hybrid polymer networks with excellent dielectric properties[J].Composites Science and Technology,2006,66（11）:1749-1755.
[12]	JIANG H,WANG R M,SHAMEEL F,et al.Optimization and preparation of an allyl phenoxy-modified bismaleimide resin[J].High Performance Polymers,2016,28（6）:677-684.
[13]	LIU C,DONG Y F,LIN Y,et al.Enhanced mechanical and tribological properties of graphene/bismaleimide composites by using reduced graphene oxide with non-covalent functionalization[J].Composites Part B,2019,165（2）:491-499.
[14]	ZOU Q,XIAO F,GU S Q,et al.Toughening of bismaleimide resin based on the self-assembly of flexible aliphatic side chains[J].Industrial and Engineering Chemistry Research,2019,58（36）:16526-16531.
[15]	QU C Y,CHANG J Y,LIU C W,et al.Novel allyl and propenyl monomers for modification of the bismaleimide resins,with excellent dielectric properties and high glass transition temperatures[J].High Performance Polymers,2020,32（1）:116-126.
[16]	WANG K X,WANG Y Y,CHEN P,et al.Novel bismaleimide resins modified by allyl compound containing liquid crystalline structure[J].Advances in Polymer Technology,2018,37（1）:281-289.
[17]	王居临,王钧.环氧树脂改性双马来酰亚胺复合材料力学性能及耐热性能研究[J].玻璃钢/复合材料,2014（5）:25-31.
[18]	WU G L,KOU K C,CHAO M,et al.Preparation and characterization of bismaleimide-triazine/epoxy interpenetrating polymer networks[J].Thermochimica Acta,2012,537:44-50.
[19]	JENA R K,YUE C Y,SK M M,et al.A novel high performance bismaleimide/diallyl bisphenol A （BMI/DBA） –epoxy interpenetrating network resin for rigid riser application[J].RSC Advances,2015,97（5）:79888-79897.
[20]	祝君军,文友谊,何屹,等.改性双马来酰亚胺树脂的化学流变性研究[J].塑料工业,2018,46（8）:85-88.
[21]	ROZENBERG B A,DZHAVADYAN E A,MORGAN R,et al.High‐performance bismaleimide matrices:cure kinetics and mechanism[J].Polymers for Advanced Technologies,2002,13（10）:837-844.
[22]	LIU X Y,LI L,CHEN Z B,et al.Curing behavior,thermal,and mechanical properties of N,N′-（4,4′-diphenylmethane）bismaleimide/2,2′-diallylbisphenol A/3-allyl-5,5-dimethylhydantoin resin system[J].High Performance Polymers,2020,32（6）:631-644.
[23]	周浩然,荆佳奇,王德志,等.双马来酰亚胺工艺改性及性能[J].复合材料学报,2020,37（6）:1278-1284.
[24]	HUANG F W,HUANG F R,ZHOU Y,et al.Preparation and properties of bismaleimide resins modified with hydrogen silsesquioxane and dipropargyl ether and their composites[J].Polymer Journal,2010,42（3）:261-267.
[25]	DAI S C,YAN W,LIU H Y,et al.Experimental study on Z-pin bridging law by pullout test[J].Composites Science and Technology,2004,64（16）:2451-2457.