复合材料梯形胶接共固化分析及多目标优化

薛晓; 孙运刚; 宣善勇

doi:10.13224/j.cnki.jasp.20220921

复合材料梯形胶接共固化分析及多目标优化

doi: 10.13224/j.cnki.jasp.20220921

国营芜湖机械厂，安徽芜湖 241000

基金项目: 安徽省科技重大专项项目（202203a05020039）

详细信息

作者简介:
薛晓（1995-），女，工程师，硕士，主要从事复合材料的修复设计及力学行为研究

通讯作者:
宣善勇（1980−），男，高级工程师，博士，主要从事复合材料损伤评估与修复设计研究。E-mail：syxuan@mail.ustc.edu.cn

中图分类号: V258⁺.3
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- 文章访问数: 146
- HTML浏览量: 146
- PDF量: 39
- 被引次数: 0
出版历程
- 收稿日期: 2022-11-30
- 网络出版日期: 2024-08-01

Analysis and multi-objective optimization of the scarf bonded composite co-curing process

Wuhu State-owned Factory of Machining，Wuhu Anhui 241000，China

摘要

摘要:
考虑J-116B胶黏剂和ZT7H/QY9611预浸料两种材料体系，对复合材料梯形胶接结构共固化行为和残余应力分布进行了数值模拟，结果显示胶接结构内部在快速固化阶段呈现双峰过热行为，而且放热叠加效应导致补片-胶层界面残余热应力显著偏高；同时，以胶接面补片纤维方向、梯形斜度、升温速率为设计变量，对固化残余应力进行优化设计，结果表明当胶接面补片纤维方向为45°、梯形斜度为1∶20、升温速率为2 K/min时，胶层残余热应力最大值仅为10.23 MPa，较优化前降幅76.7%。
- 复合材料 /
- 梯形胶接 /
- 共固化 /
- 残余应力 /
- 多目标优化
Abstract:
Considering two materials of J-116B adhesive and ZT7H/QY9611 composite prepreg, the co-curing behavior and residual stress distribution of the scarf bonding composite structure were numerically simulated, and the results showed that the scarf bonded structure exhibited bimodal overheating behavior in the rapid curing stage, and the exothermic superposition effect led to a significantly high residual thermal stress at the patch-adhesive interface layer. At the same time, the fiber direction, scarf slope and heating rate were taken as the design variables to optimize the curing residual stress, and the results showed that increasing the scarf slope, reducing the heating rate or tending to the width direction of the fiber direction are conducive to the reduction of curing residual stress; when the fiber direction of the adhesive joint was 45°, the scarf slope was 1∶20 and the heating rate was 2 K/min, the maximum residual thermal stress of the adhesive layer was only 10.23 MPa, 76.7% lower than that before optimization.
- composite /
- scarf bonding /
- co-curing /
- residual stress /
- multi-objective optimization

HTML

图 1 两种材料的DSC曲线

Figure 1. DSC curves of two materials

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图 2 复合材料梯形胶接结构有限元模型和1/2模型细节网格

Figure 2. Finite element model and 1/2 model detail mesh of scarf bonding structure of composite material

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图 3 固化边界条件及设定温度曲线

Figure 3. Curing boundary condition and temperature curve setting

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图 4 固化过程及残余应力的数值模拟流程图

Figure 4. Numerical simulation flow chart of curing process and residual stress

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图 5 补片和胶层中心单元的固化过程曲线

Figure 5. Curing process curves of the central unit of the patch and adhesive

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图 6 结构不同位置结点的应力-时间曲线

Figure 6. Stress-time curves of nodes at different locations of the structure

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图 7 沿着纤维方向补片和胶层各单元的残余应力

Figure 7. Residual stress of elements of the patch and adhesive along the fiber direction

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图 8 残余应力近似函数的残差正态图

Figure 8. Residual normal graph of approximate function of residual stress

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图 9 三维响应曲面和等高线图

Figure 9. 3D response surface and contour map

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表 1 ZT7H/QY9611复合材料预浸料的物理性能参数

Table 1. Physical performance parameters of ZT7H/QY9611 composite prepregs

ρ/（kg/m³）	c/（J/ （kg·K））	K₁₁/（W/ （m·K））	K₂₂, K₃₃/（W/ （m·K））	ΔH/（J/g）	E/（J/mol）	A/10⁷ s⁻¹	n
1514	789	3.84	0.41	139	92410	3.5	1.485

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表 2 J-116B胶黏剂的物理性能参数

Table 2. Physical performance parameters of J-116B adhesive

ρ/（kg/m³）	c/（J/ （kg·K））	K/（W/ （m·K））	ΔH₁/（J/g）	ΔH₂/（J/g）	E₁/（J/mol）	E₂/（J/mol）	A₁/10⁷ s⁻¹	A₂/10⁷ s⁻¹	m	n
1270	1877	0.39	107	125	69530	72360	3.55	3.67	0.82	1.07

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表 3 试验矩阵设计与仿真结果

Table 3. Test matrix design and simulation results

序号	x/（°）	θ	k/（K/min）	R/MPa
1	90	1∶20	3	14.64
2	45	1∶20	2	10.23
3	90	1∶20	1	42.82
4	0	1∶10	2	15.35
5	0	1∶20	1	43.93
6	90	1∶10	2	15.49
7	0	1∶20	3	13.61
8	90	1∶30	2	21.39
9	0	1∶30	2	21.49
10	45	1∶30	1	22.22
11	45	1∶30	3	21.45
12	45	1∶10	3	20.46
13	45	1∶10	1	16.44

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表 4 优化结果与有限元算例结果对比

Table 4. Comparison between optimization results and finite element example results

组别	x/（°）	θ	k/（K/min）	R/MPa
优化结果	46.168	1∶20	2.146	8.64
有限元算例	45	1∶20	2	10.23
误差/%			18.4

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