Effect of film cooling hole shape on creep properties of CMSX-10 plate specimens
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摘要:
针对第三代镍基高温合金CMSX-10平板试样,分别设计带有倾角与偏航角的圆孔、扩张孔、W形孔3种孔形的气膜孔并开展高温蠕变试验,研究了气膜孔孔形对镍基单晶合金冷却叶片模拟试样高温持久断裂寿命的影响。结果表明:在980 ℃和350 MPa条件下,圆孔试样的高温持久断裂寿命大约为扩张孔试样的1.3倍,扩张孔试样的高温持久断裂寿命大约为W形孔试样的1.3倍。结合扫描电镜分析发现:平板试样的蠕变断裂形式主要是在气膜孔周边区域产生应力集中之后引起的类解理和韧窝混合型断裂。基于晶体塑性理论对3种气膜孔孔形平板试样进行模拟分析,模拟结果显示在气膜孔周边存在应力集中和应力重分布,数值模拟分析结果与观察试样断口形貌得到的断裂特征吻合。采用改进的Lemaitre蠕变损伤模型与Larson-Miller方程来预测圆孔CMSX-10平板试样的蠕变断裂寿命,结果表明基于改进的Lemaitre 蠕变损伤模型预测蠕变寿命精度更高。
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关键词:
- CMSX-10平板试样 /
- 镍基单晶合金 /
- 气膜孔孔形 /
- 晶体塑性理论 /
- 蠕变性能
Abstract:Three types of film holes with inclination and yaw angles, namely circular holes, expansion holes, and W-shaped holes, were designed to study the creep properties of the third-generation nickel based high-temperature alloy CMSX-10 with the cooling blade simulation specimens. High temperature creep tests were conducted to investigate the effect of hole shape on the rupture life of simulation specimens. The results showed that, the rupture life of the circular hole specimen was about 1.3 times that of the expanded hole specimen, and the rupture life of the expanded hole specimen was about 1.3 times that of the W-shaped hole specimen under the average stress of 350 MPa and temperature of 980 ℃. Combined with scanning electron microscopy analysis, it was found that the creep fracture of the sample was a mixed mode of cleavage and dimple fracture caused by stress concentration near the film hole. Based on crystal plasticity theory, simulation analysis was conducted. The simulation results showed stress concentration and redistribution around the film holes. The simulation results can explain the fracture characteristics obtained from experiments. The improved Lemaitre creep damage model and Larson Miller equation were sed to predict the creep fracture life of CMSX-10 flat plate specimens with circular holes. The results showed that the accuracy of predicted creep life based on the improved Lemaitre creep damage model was higher.
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成分 质量分数/% 成分 质量分数/% Cr 2.000 Re 6.000 Co 3.000 Hf 0.030 Mo 0.400 Nb 0.100 W 5.000 Ti 0.200 Al 5.700 Ni 余量 Ta 8.000 表 2 蠕变本构模型参数(试验温度为980 ℃)
Table 2. Parameters of creep constitutive model (test temperature of 980 ℃)
参数 数值 $ {\dot \gamma _0}^{ ( \delta ) } $/10−18 1.19 $ n $ 5.94 $ C $ 45.45 $ P $ 0.9 $ \dot{\omega}_0^{(\delta)} $ 1.0 $ m $ 1.0 表 3 980 ℃下 CMSX-10试样的主要蠕变数据
Table 3. 980 ℃ main creep data of CMSX-10 samples
$ \sigma $/MPa $ {\tau _{{\text{max}}}} $/MPa $ {{{t}}_{\text{r}}} $/h 300 141.42 107.6 350 164.99 58.2 400 188.56 27 450 212.13 13.22 500 235.7 5.42 表 4 蠕变损伤模型参数值(980 ℃)
Table 4. Parameter values of creep damage model (980 ℃)
参数 数值 $ \alpha $ 0.00367 $ \beta $ 337.4762 $ \eta $ 5.6792 表 5 CMSX-10材料的 Larson-Miller 模型参数
Table 5. Larson-Miller model parameters for CMSX-10 materials
参数 数值 b0 − 16.4217 b1/105 7.8522 b2/105 − 8.8416 b3/105 3.5449 b4/104 − 4.7935 表 6 CMSX-10镍基单晶合金[001]取向蠕变寿命预测值
Table 6. Prediction of creep life of CMSX-10 nickel based single crystal alloy in [001] orientation
参数 数值 蠕变应力σ/ MPa 350 蠕变试验断裂时间 tr/h 58.2 本文模型 预测蠕变寿命/h 57.9 误差1/h −0.3 L-M 法 预测蠕变寿命/h 55.88 误差2/h −2.32 -
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